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Q&T Hi-Tech Polymer Secures Contract B06/2026 with National Banknote Printing Plant

Q&T Hi-tech Polymer

26 Dec 2025

Signing Ceremony for Supply of Security Printing Substrate Code B06/2026

On December 5, 2025, at the National Banknote Printing Plant (NBPP), Q&T Hi-Tech Polymer Co., Ltd. officially signed the contract for the supply of security printing substrate under package B06/2026, in cooperation with its consortium partner TFS.

The successful signing of this contract marks another important milestone in the long-term collaboration between Q&T and the NBPP, reaffirming the trust placed in Q&T’s technical capability, product quality, and reliability in the field of high-tech security materials.

Under Contract B06/2026, Q&T will continue to provide advanced security printing substrates that meet strict technical and quality requirements for banknote production. The project reflects Q&T’s strong commitment to innovation, stable production capacity, and continuous improvement in research and development to meet the growing demands of the security printing industry.

More than a commercial agreement, this cooperation represents Q&T’s ongoing dedication to supporting the National Banknote Printing Plant and Vietnam’s banking sector by contributing effective anti-counterfeiting solutions and enhancing the safety and integrity of currency circulation.

With a clear strategy focused on technology, quality, and sustainability, Q&T Hi-Tech Polymer remains committed to strengthening its role as a trusted partner in the security printing value chain and to expanding long-term cooperation with domestic and international partners.

© 2024 by Q&T Hi-tech Polymer. 

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