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Signing Ceremony for Supply of Security Printing Substrate Code B07

Q&T Hi-tech Polymer

5 Dec 2025

Signing Ceremony for Supply of Security Printing Substrate Code B07

On December 05, 2025, at the National Banknote Printing Plant (NBPP), a contract signing ceremony was held for the supply of security printing substrate, code B07 – 2026, between the National Banknote Printing Plant, and the contractor consortium of Q&T and TFS.

Being continually selected by the NBPP is the clearest testimony to Q&T’s superior quality, stability, and advanced research and production capability within the high-tech security material sector.

The B07 contract is more than a business transaction; it is a reaffirmation of Q&T's commitment to supporting the NBPP and Vietnam's Banking Industry. We aim to provide the most effective anti-counterfeiting solutions, contributing to the protection of economic security and promoting the nation's sustainable development.

© 2024 by Q&T Hi-tech Polymer. 

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