
Q&T Hi-Tech Polymer Signs Contract for Supplying Security Printing Substrate B05 – 2026

Q&T Hi-tech Polymer
20 thg 10, 2025
Signing Ceremony Supply of Security Printing Substrate Code B05
On October 20, 2025, at National Banknote Printing Plant (NBPP), a contract signing ceremony was held for the supply of security printing substrate, code B05 – 2026, between the Procuring Agency – NBPP, and the contractor consortium of Q&T and TFS.
This milestone marks not only another achievement for Q&T in maintaining its strong position in the domestic market, but also serves as a testament to the quality, reliability, and production capability of Q&T’s products.
Through this contract, Q&T continues to affirm its commitment to providing high-quality security materials and its contribution to the sustainable development of Vietnam’s printing and anti-counterfeiting industry.